Edgeboard Connectors

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395-044-521-201
CONN EDGE DUAL FMALE 44POS 0.100
EDAC Inc.
827
In Stock
1 : 8,82000 €
Bulk
Bulk
Active
Non Specified - Dual Edge
Female
22
44
0.054" ~ 0.070" (1.37mm ~ 1.78mm)
2
0.100" (2.54mm)
Dual
-
Through Hole
Solder
Copper Alloy
Gold
10.0µin (0.25µm)
Cantilever
Black
-
-40°C ~ 105°C
395-044-520-202
CONN EDGE DUAL FMALE 44POS 0.100
EDAC Inc.
121
In Stock
1 : 8,82000 €
Bulk
Bulk
Active
Non Specified - Dual Edge
Female
22
44
0.054" ~ 0.070" (1.37mm ~ 1.78mm)
2
0.100" (2.54mm)
Dual
-
Through Hole
Solder
Copper Alloy
Gold
10.0µin (0.25µm)
Cantilever
Black
Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia
-40°C ~ 105°C
395-044-520-802
CONN EDGE DUAL FMALE 44POS 0.100
EDAC Inc.
96
In Stock
1 : 4,41000 €
Bulk
Bulk
Active
Non Specified - Dual Edge
Female
22
44
0.054" ~ 0.070" (1.37mm ~ 1.78mm)
2
0.100" (2.54mm)
Dual
-
Through Hole
Solder
Copper Alloy
Gold
10.0µin (0.25µm)
Cantilever
Black
Top Mount Opening, Unthreaded, 0.128" (3.25mm) Dia
-40°C ~ 105°C
395-044-520-201
CONN EDGE DUAL FMALE 44POS 0.100
EDAC Inc.
28
In Stock
1 : 8,82000 €
Bulk
Bulk
Active
Non Specified - Dual Edge
Female
22
44
0.054" ~ 0.070" (1.37mm ~ 1.78mm)
2
0.100" (2.54mm)
Dual
-
Through Hole
Solder
Copper Alloy
Gold
10.0µin (0.25µm)
Cantilever
Black
-
-40°C ~ 105°C
395-044-524-202
CONN EDGE DUAL FMALE 44POS 0.100
EDAC Inc.
3
In Stock
1 : 4,03000 €
Bulk
Bulk
Active
Non Specified - Dual Edge
Female
22
44
0.054" ~ 0.070" (1.37mm ~ 1.78mm)
2
0.100" (2.54mm)
Dual
-
Through Hole
Solder
Copper Alloy
Gold
10.0µin (0.25µm)
Cantilever
Black
Flush Mount, Top Opening, Unthreaded, 0.128" (3.25mm) Dia
-40°C ~ 105°C
Showing
of 5

Edgeboard Connectors


Card edge or edgeboard connectors are a style of connector system in which (typically) a pattern of exposed copper regions at the periphery of a printed circuit board constitutes one-half of a mating connector pair. A common use case being the connection of accessory cards such as graphics accelerators to computer motherboards in desktop PC applications, they offer a relatively low-cost, high density interconnect option for applications where durability is not a primary concern.