- Audio/Video Processing
- Battery Charging
- Circuit Protection
- Data Conversion
- Data Storage
- Display Systems
- Embedded Processing
- Energy Harvesting
- Energy Storage
- Eval/Dev Tool
- General Purpose
- Human Interface
- Industrial Control
- IoT Internet of Things
- Motor Control
- Optical Communication
- Power Management
- RF/EMI Shielding
- Signal Processing
- Single Board Computer
- Thermal Management
- Timing & Clock Management
- Wired Communication
- Wireless Communication
Vishay Siliconix's p-channel TrenchFET® GEN III and IV MOSFETs have the lowest on-resistance per area for p-channel MOSFETs.
Phoenix Contact's FDX 20 series compact and uniform design offers generous interior space for the secure connection of fiber optics.
Molex's double-ended M12 to RJ45 CAT6 cordsets are designed for high-speed transmission of up to 10 Gb Ethernet data that covers the need for POE transmission.
Linear Technology / Analog Devices’ LTC2378 have a high-speed SPI-compatible serial interface that supports 1.8 V, 2.5 V, 3.3 V, and 5 V logic.
Switchcraft's high-quality jacks are available in a wide variety of options, including sealed to IP66 standards.
Bosch Sensortec's BMA400 accelerometer offers ultra-low power for consumer applications.
The MPR series from Honeywell is a very small piezoresistive silicon pressure sensor offering a digital output for reading pressure.
Fair-Rite’s flexible ferrite sheets provide the benefits of soft-magnetic materials while freeing users from their mechanical constraints.
Linear Technology/Analog Devices' LTC2348 are 16-bit and 18-bit, low noise 8-channel simultaneous sampling successive approximation register (SAR) ADCs.
Adafruit's SGP30 has a standard hot-plate MOX sensor as well as a small microcontroller.
Fair-Rite’s engineering kits provide a comprehensive listing of material types and forms to fit any application.
Fair-Rite's 75 material is available in snap-it form allowing users to find a solution to their low-frequency noise issues quickly.
Panasonic's AQV25_G3 series high capacity PhotoMOS® relays provide greatly increased load current in a compact DIP package.
Texas Instruments' TPS6301x buck-boost converters are packaged in a 20-pin DSBGA package measuring 2.126 mm x 1.922 mm (YFF).