Heat Sinks

Results: 114.165
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114.165Results
Showing
of 114.165
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
507302B00000G
507302B00000G
HEATSINK TO-220 2.5W LOW PROFILE
Boyd Laconia, LLC
36.049
In Stock
1 : 0,31000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Square, Fins
0.750" (19.05mm)
0.750" (19.05mm)
-
0.380" (9.65mm)
2.5W @ 60°C
10.00°C/W @ 200 LFM
24.00°C/W
Aluminum
Black Anodized
V7236B1
V7236B1
HEATSINK TO-220 19.05X13.21MM
Assmann WSW Components
4.182
In Stock
1 : 0,34000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
-
-
24.00°C/W
Aluminum
Black Anodized
V8508A
V8508A
HEATSINK TO-220 19X12.80MM
Assmann WSW Components
3.586
In Stock
1 : 0,41000 €
Bulk
-
Bulk
Active
Board Level
TO-220
Press Fit
Rectangular, Fins
0.748" (19.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
3.0W @ 60°C
14.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
290-1AB
290-1AB
HEATSINK TO-220 VERT/HORZ BLK
Wakefield-Vette
5.536
In Stock
1 : 0,49000 €
Bulk
Bulk
Active
Board Level
TO-218, TO-202, TO-220
Bolt On
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
2.0W @ 44°C
7.00°C/W @ 400 LFM
22.00°C/W
Aluminum
Black Anodized
V-1100-SMD/B-L
V-1100-SMD/B-L
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
5.645
In Stock
1 : 0,54000 €
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
V2017B
V2017B
HEATSINK ANOD ALUM CPU
Assmann WSW Components
4.645
In Stock
1 : 0,63000 €
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
-
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
-
-
31.00°C/W
Aluminum
Black Anodized
5.560
In Stock
1 : 0,66000 €
Tray
-
Tray
Active
Board Level
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.181" (30.00mm)
-
0.472" (12.00mm)
-
-
10.00°C/W
Aluminum
Black Anodized
577102B04000G
577102B04000G
HEATSINK TO-220 W/TAB .375"
Boyd Laconia, LLC
5.893
In Stock
1 : 0,70000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
1.0W @ 30°C
8.00°C/W @ 400 LFM
25.90°C/W
Aluminum
Black Anodized
287-1ABE
287-1ABE
HEATSINK FOR TO220
Wakefield-Vette
3.948
In Stock
1 : 0,77000 €
Bulk
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.180" (29.97mm)
1.000" (25.40mm)
-
0.500" (12.70mm)
4.0W @ 65°C
7.80°C/W @ 200 LFM
16.20°C/W
Aluminum
Black Anodized
577202B00000G
577202B00000G
HEAT SINK TO-220 .500" COMPACT
Boyd Laconia, LLC
11.826
In Stock
1 : 0,80000 €
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
1.5W @ 40°C
10.00°C/W @ 200 LFM
24.40°C/W
Aluminum
Black Anodized
576802B04000G
576802B04000G
HEAT SINK VERT PLUG-IN TO-220
Boyd Laconia, LLC
12.581
In Stock
1 : 0,87000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220, TO-262
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.500" (12.70mm)
-
0.500" (12.70mm)
1.0W @ 30°C
7.00°C/W @ 400 LFM
27.30°C/W
Aluminum
Black Anodized
577102B00000G
577102B00000G
HEAT SINK TO-220 .375" COMPACT
Boyd Laconia, LLC
5.782
In Stock
1 : 0,89000 €
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
3.0W @ 80°C
12.00°C/W @ 200 LFM
25.90°C/W
Aluminum
Black Anodized
110991327
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
23.767
In Stock
1 : 0,94000 €
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
573300D00010(G)
573300D00010G
HEATSINK D2PAK .4" HIGH SMD
Boyd Laconia, LLC
57.279
In Stock
1 : 0,99000 €
Cut Tape (CT)
250 : 0,74196 €
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.030" (26.16mm)
-
0.400" (10.16mm)
1.3W @ 30°C
10.00°C/W @ 200 LFM
18.00°C/W
Aluminum
Tin
658-25AB, T1, T2, T4
658-25AB
HEATSINK CPU 28MM SQ BLK
Wakefield-Vette
10.765
In Stock
1 : 1,05000 €
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.100" (27.94mm)
1.100" (27.94mm)
-
0.250" (6.35mm)
2.0W @ 40°C
5.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
Same Sky (Formerly CUI Devices)
6.357
In Stock
1 : 1,09000 €
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
574502B03300G
574502B03300G
HEATSINK TO-220 VERT MNT W/TAB
Boyd Laconia, LLC
9.336
In Stock
1 : 1,14000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.810" (20.57mm)
-
0.390" (9.91mm)
3.0W @ 60°C
6.00°C/W @ 600 LFM
21.20°C/W
Aluminum
Black Anodized
658-60AB, T1, T2, T3
658-60AB
HEATSINK CPU 28MM SQ BLK W/OTAPE
Wakefield-Vette
160
In Stock
1 : 1,29000 €
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.100" (27.94mm)
1.100" (27.94mm)
-
0.598" (15.20mm)
2.5W @ 30°C
2.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
375424B00034G
375424B00034G
HEATSINK PIN-FIN W/TAPE
Boyd Laconia, LLC
3.111
In Stock
1 : 1,32000 €
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.598" (15.19mm)
0.598" (15.19mm)
-
0.252" (6.40mm)
-
17.60°C/W @ 200 LFM
62.50°C/W
Aluminum
Black Anodized
573100D00010G
573100D00010G
HEATSINK SMT D-PAK/TO-252 TIN
Boyd Laconia, LLC
16.313
In Stock
1 : 1,36000 €
Cut Tape (CT)
250 : 1,01460 €
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
26.00°C/W
Aluminum
Tin
513102B02500(G)
513102B02500G
HEATSINK TO-220 W/PINS 1.5"TALL
Boyd Laconia, LLC
8.730
In Stock
1 : 1,41000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.500" (38.10mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
8.0W @ 80°C
3.00°C/W @ 500 LFM
11.00°C/W
Aluminum
Black Anodized
3083
3083
ALUM HEAT SINK FOR RASPBERRY PI
Adafruit Industries LLC
1.032
In Stock
1 : 1,43000 €
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi 3
Thermal Tape, Adhesive (Included)
Square, Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.315" (8.00mm)
-
-
-
Aluminum
-
LTN20069-T5
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield-Vette
6.084
In Stock
1 : 1,48000 €
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
513201B02500(G)
513201B02500G
HEATSINK TO-218/TO-247 W/PINS 2"
Boyd Laconia, LLC
1.745
In Stock
1 : 1,48000 €
Bulk
-
Bulk
Active
Board Level, Vertical
TO-218
Bolt On and PC Pin
Rectangular, Fins
2.000" (50.80mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
2.0W @ 20°C
3.00°C/W @ 400 LFM
8.30°C/W
Aluminum
Black Anodized
637-10ABPE
637-10ABPE
HEATSINK TO-220 VERT MT BLK 1"
Wakefield-Vette
2.634
In Stock
1 : 1,54000 €
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and Board Mounts
Rectangular, Fins
1.000" (25.40mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
6.0W @ 76°C
5.80°C/W @ 200 LFM
-
Aluminum
Black Anodized
Showing
of 114.165

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.