SMD to DIP SOIC 22 0.050" (1.27mm) FR4 Epoxy Glass
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DIP300-SOIC-22N

DigiKey Part Number
315-DIP300-SOIC-22N-ND
Manufacturer
Manufacturer Product Number
DIP300-SOIC-22N
Description
DIP-22 (0.3" WIDTH, 0.1" PITCH)
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
SMD to DIP SOIC 22 0.050" (1.27mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
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Category
Number of Positions
22
Manufacturer
Chip Quik Inc.
Pitch
0.050" (1.27mm)
Packaging
Bulk
Board Thickness
0.063" (1.60mm)
Part Status
Active
Material
FR4 Epoxy Glass
Proto Board Type
SMD to DIP
Size / Dimension
1.100" L x 0.400" W (27.94mm x 10.16mm)
Package Accepted
SOIC
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 47
Check for Additional Incoming Stock
Once available stock of this product has been depleted, manufacturer standard package and lead time will apply.
All prices are in EUR
Bulk
QuantityUnit PriceExt Price
110,75000 €10,75 €
59,30400 €46,52 €
108,79100 €87,91 €
258,19320 €204,83 €
Manufacturers Standard Package
Unit Price without VAT:10,75000 €
Unit Price with VAT:13,00750 €