MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

Related Parts

AfbeeldingOnderdeelnr. fabrikantBeschrijvingBevestigingsmethodeVormAvailable QuantityPrijsDetails weergeven
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MMThermische tape, lijm (inbegrepen)Vierkant, hoekige vinnen90 - Immediate$11.28Details weergeven
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MMClip, thermisch materiaalVierkant, hoekige vinnen0 - Immediate$12.14Details weergeven
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MMThermische tape, lijm (inbegrepen)Vierkant, hoekige vinnen77 - Immediate$10.02Details weergeven
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MMClip, thermisch materiaalVierkant, vinnen607 - Immediate$14.35Details weergeven
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MMClip, thermisch materiaalVierkant, hoekige vinnen935 - Immediate$14.94Details weergeven
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MMClip, thermisch materiaalVierkant, hoekige vinnen60 - Immediate$14.76Details weergeven
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MMClip, thermisch materiaalVierkant, hoekige vinnen32 - Immediate$14.51Details weergeven
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MMClip, thermisch materiaalVierkant, hoekige vinnen100 - Immediate$14.62Details weergeven
HEAT SINK 19MM X 19MM X 9MMATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MMThermische tape, lijm (inbegrepen)Vierkant, hoekige vinnen1367 - Immediate$7.61Details weergeven
PTM Published on: 2011-10-13

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Related Product Highlight

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Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.