TRCDrive Pack™ in DOT247/HSDIP20-Gehäusen

ROHM offers a portfolio of high-performance silicon carbide (SiC) power modules across multiple package platforms, including TRCDRIVE pack, HSDIP20, and DOT-247, designed for automotive and industrial applications. These products represent distinct packaging technologies rather than a single unified series. This lineup includes part numbers such as BST400D12P4A101 (TRCDRIVE pack), BST70B2P4K01-VC (HSDIP20), and SCZ4011KTA (DOT-247), providing designers with flexible options for power conversion and motor drive solutions. The BST400D12P4A101 is a 1200 V, 394 A half-bridge module in the TRCDRIVE pack platform, optimized for high-power industrial applications such as inverters, converters, and energy systems, delivering high current handling and reliable switching performance. The BST70B2P4K01-VC HSDIP20 module offers a 4-in-1 full-bridge structure rated at 1,200 V and 70 A, ideal for PFC and LLC circuits in onboard chargers, with excellent thermal dissipation and over three times the power density of top-side cooled discrete devices. The SCZ4011KTA DOT-247 2-in-1 module provides 1,200 V, 106 A half-bridge performance with available internal configurations such as half-bridge or common-source. Multilevel converter topologies such as 3-level NPC, 3-level T-NPC, and 5-level ANPC can be implemented at the system level using these modules, rather than being internally integrated. These packages integrate high-performance SiC MOSFETs within optimized module structures. The ROHM SiC module portfolio simplifies system design, reduces board space, and enables miniaturization of power conversion circuits. These modules exemplify the ROHM commitment to high-density, high-efficiency, and reliable solutions for modern power electronics, supporting the development of next-generation automotive powertrains, industrial equipment, and energy systems.