eMagazines and eBooks

Volume 30 takes a look at some of the innovations helping industries work better today while preparing for what’s next.

Volume 29 is all about getting comfortable with the analog and mixed-signal building blocks that show up in everyday designs.

Volume 28 brings together insights from leading semiconductor and hardware innovators, alongside practical technical articles for modern engineers.

Volume 27, Interconnect is packed with fresh insights, helpful tips, and expert perspectives from some of the biggest names in connectivity.

Volume 26 will explore the dynamic and ever-evolving world of RF and wireless technology. It brings together a diverse set of articles designed to inform, inspire, and empower engineers, designers, and tech enthusiasts navigating the complexities of modern wireless connectivity.

The Passives eMagazine Volume 25 will delve into the intricacies and innovations shaping the world of passive components and electronic design.

Volume 24 will explore the transformative technologies shaping the future of transportation. As the industry accelerates toward smarter, safer, and more sustainable mobility, innovation continues to fuel every facet of development—from vehicle electrification to advanced sensing systems.

Volume 23 delves into the evolving world of power electronics and innovative system design. As technology continues to push the boundaries of performance, efficiency, and reliability, engineers are met with both unprecedented challenges and opportunities.

Volume 22 examines the technological advancements and engineering innovations driving the next generation of robotic systems across industrial, service, and collaborative domains.

Volume 21 will cover topics such as speed drives and frequency drives, DIN rail power, cybersecurity, de-energizing circuits, terminal blocks and industrial interconnect, thermal regulation, and more.