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TE Connectivity heat shrink tubing is easy to install and helps enhance insulation, sealing, and overall cable organization.
This White Paper discusses a variety of retrofit solutions and the importance of following an engineering design strategy that carefully considers material properties and their impact on component performance.
This white paper investigates challenges related to miniaturization and offers design considerations for overcoming them with a focus on antenna design, PCB connectors and associated components.
Heat shrink tubing delivers dependable electrical insulation, mechanical protection, environmental sealing, and strain relief—all in one versatile solution.
Kemtron EMI/RFI shielding products are commonly used in aerospace, defense, industrial, medical, and advanced electronics applications, especially where high performance shielding must coexist with compact designs and rugged requirements.
This whitepaper outlines the limitations of the 12V system in meeting the growing demands of future vehicles and demonstrates how 48V – particularly when paired with zonal architecture – offers a scalable and efficient foundation for next-generation vehicle design
The BCON+ connection system combines the advantages of solid steel-to-steel bolt termination with the extremely low contact resistance of copper contact elements.
AI is driving unprecedented change in data centers -from rising GPU density and faster data rates to exponential power growth.
Connectivity’s RayFlite cable series 4kV for electric powered and hybrid aircraft applications.
Der SPE-M12-Hybridsteckverbinder SPE-M12 von TE Connectivity AMP Connectors wurde für raue Umgebungen entwickelt und bietet Schutzart IP67 sowie einen sicheren Verriegelungsmechanismus.
Die LUMAWISE Endurance-Brücke von TE Connectivity wurde entwickelt, um die Entfernung zwischen entfernt montierten Sensoren oder Steuergeräten und einer Leuchte zu überbrücken.
Die Steckverbinder der Serie AMP AMPFOIL ULTRA von TE Connectivity wurden entwickelt, um die Anforderungen von Anwendungen mit flexiblen Flachkabeln (FFC) und flexiblen gedruckten Schaltungen (FPC) zu erfüllen.
Computer-on-Module-(CoM)-Express-Steckverbinder mit 0,5 mm lichter Höhe und Datenübertragungsraten von 25 Gbit/s
Datum der Veröffentlichung: 2026-03-25
Die CoM-Express-Steckverbinder von TE Connectivity AMP Connectors mit einer lichten Höhe von 0,5 mm bieten Datenübertragungsraten von bis zu 25 Gbit/s, verbesserte Signalintegrität und volle Abwärtskompatibilität.
Die mehrfarbigen Draht-zu-Platine-Leistungssteckverbinder QP 6.5 von TE Connectivity unterstützen Leiterplattenhersteller bei der Steigerung der Montageeffizienz.
LEAVYSEAL connectors provide sealed, high-performance connectivity for hybrid signal and power systems in harsh environments.
Die modularen RJ45-Buchsen von TE Connectivity bieten eine durchgängige, hochintegrierte Ethernet-Konnektivitätslösung vom Kabel bis hin zur physikalischen Schicht.
Creating a safer, sustainable, and connected world is our mission at TE Connectivity. But how do we turn that into reality? A major part is innovating at the product level to help our customers reduce their carbon footprint.
You don’t need to choose between performance and sustainability. ECONIDUR plating is engineered for the harsh realities of industrial automation, offering: Unmatched vibration resistance, Critical signal integrity, and proven long-term reliability.
We solved the performance vs. sustainability equation. ECONIDUR plating delivers gold-standard performance while cutting CO2 emissions by over 23%. But how do we guarantee reliability?
For decades, gold has been the undisputed standard for connector plating. But its environmental cost is no longer sustainable. TE Connectivity's answer is here: ECONIDUR Nickel-Phosphorus Plating.
