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BeCu-Finger-Stock-Dichtungsmanschetten
Datum der Veröffentlichung: 2024-08-12
Die Berylliumkupfer-Finger-Stock-Dichtungen von Orbel sind ideal für Anwendungen mit wiederholten Öffnungs- und Schließvorgängen, die eine hohe Dämpfungsperformance und eine hohe mechanische Festigkeit erfordern.
Platinenabschirmlösung Groove-Loc™
Aktualisiert: 2024-08-12
Die Groove-Loc™-Lösung von Orbel bietet eine maßgefertigte Abdeckung und nutzt eine extrem lötfähige und korrosionsbeständige Nickel-Silber-Legierung für eine präzise Passung.
Abschirmung auf Platinenebene EZ-Shield™ (BLS)
Datum der Veröffentlichung: 2024-07-15
Die BLS-Technologie EZ-Shield™ von Orbel bietet eine breite Palette von Abschirmungslösungen in Standard- und kundenspezifischer Bauform.
Our gaskets are manufactured from a resilient open cell urethane foam core with a durable high performance electrically conductive copper-nickel plated nylon ripstop fabric.
Important factors that must be considered during gasket selection are RF impedance, shielding effectiveness, material compatibility, corrosion control, gasket height, compression force, compressibility, compression range, compression set, and environment.
As wireless devices continue to proliferate in medical facilities, noise reduction, increased immunity to wireless RF emissions, and EMI mitigation all need to be addressed and managed.
Orbel, the recognized leader in standard and custom Board Level Shielding, now offers the Groove-LocTM.
Platinenabschirmung EZ-Matrixx™
Datum der Veröffentlichung: 2023-05-16
Die Prototyping-Abschirmung EZ-Matrixx™ von Orbel lässt sich schnell und leicht zu einer quadratischen oder rechteckigen HF-Abschirmung für Platinen formen und kann nahezu jedes Profil abdecken.
EMI-Dichtungen Hi-Flex™ aus Gewebe über Schaum
Datum der Veröffentlichung: 2023-03-27
Die EMI-Dichtungen Hi-Flex von Orbel aus Gewebe über Schaum sind in vielen Formen und Größen erhältlich und bewältigen unterschiedliche Herausforderungen bei der EMI-Abschirmung.
Orbel is a pioneer in engineering of critical applications and solutions. To further this effort, we have developed a new prototyping shield called the Snap-Shield Groove-Loc.
Need a quick and simple shielding solution to prototype your newest board shield? Check out Orbel's EZ-Matrixx, a modular prototyping shield.
Photo chemical milled products are essential for today's modern world. This video details how these products are manufactured.
In this episode of Tech Talk with Tom Griffin, Tom has conducted a very enlightening interview with Ryan Swanton, Director of Sales at Orbel Corporation. Orbel manufacture of thin gauge metal products for mission critical applications.
There are many myths in the field of EMI/EMC, some of which are untrue, or only partially true, or based on misunderstanding. Most of these myths came about based on attempts to balance reality (accuracy) versus the time and cost spent on successfully solving EMI/EMC issues
Obtaining increased reliability means designing properly for the intended harsh environment. Better known environmental issues include extreme temperatures, vibration, shock, humidity, salt-fog, and corrosive solvents/ atmosphere.
This guide highlights the benefits of early investment in shielding, the various product features of board shields that Orbel provides, and how to procur them.
Multi-cavity board level shielding is an effective solution to combine many individual shields, which are in close proximity, into one PCB shielded enclosure.
Start to finish, from conception through delivery, Orbel offers today’s most effective board level shielding, finger-stock gaskets, metalized fabric gaskets, photo-etched precision metal parts, and precision metal stampings.
Along the way CAD systems were developed by driven software engineers. As this software evolved these programs began working in the world of three-dimensional parts, offering a screen view of a complete part.
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