Artikel und Blogs

Image of Reliable Object Detection in Harsh Industrial Environments with SICK W12 Metal Photoelectric Sensors Reliable Object Detection in Harsh Industrial Environments with SICK W12 Metal Photoelectric Sensors Datum der Veröffentlichung: 2025-11-26

Explores how SICK’s W12 metal photoelectric sensors address sensing demands in packaging, automotive, pharmaceutical, and food processing applications.

Image of Webinar – Humanoid Robotics: Connectors for Today’s Challenges – and Tomorrow’s Needs Webinar – Humanoid Robotics: Connectors for Today’s Challenges – and Tomorrow’s Needs

Facial sensors to agile limbs, humanoid robots require miniature, rugged, and high-speed connectors to withstand motion, stress, and tight design constraints.

Image of Breaking the Bottleneck of Ultra-High-Speed Signals — Introducing the New ESD/EOS Protection Weapon Breaking the Bottleneck of Ultra-High-Speed Signals — Introducing the New ESD/EOS Protection Weapon

ESD/EOS protection that doesn’t limit signal performance.

Image of A Unified Platform Approach to OEM Machine Scalability and Brownfield Integration A Unified Platform Approach to OEM Machine Scalability and Brownfield Integration Datum der Veröffentlichung: 2025-11-25

Machine control is an important industrial component. Instead of using a fragmented approach, standardizing with a single platform can be the best solution.

Image of Building Blocks for Industry 4.0 Applications Building Blocks for Industry 4.0 Applications

TE Connectivity's Internet 4.0-ready portfolio provides building blocks for new application designs focused on connectivity and safety.

Image of Data Acquisition Signal Chain Simulation Simplifies Component Selection and Testing Data Acquisition Signal Chain Simulation Simplifies Component Selection and Testing Datum der Veröffentlichung: 2025-11-24

Data acquisition design software generates circuit schematics, component recommendations, and response simulations based on user specifications.

Image of Key Considerations for Selecting the Right Connector for Rugged Applications Key Considerations for Selecting the Right Connector for Rugged Applications Datum der Veröffentlichung: 2025-11-21

With decades of experience, Harwin engineers have generated seven key factors to consider before selecting a suitable connector for rugged applications.

Image of Steel-Based Resistors Out-Power Ceramic Steel-Based Resistors Out-Power Ceramic

Thick film on steel resistors from Bourns offer density, thermal efficiency, and durability that overcome ceramic limitations in high-power applications.

Image of Using Microbe- and Hydrolysis-Resistant Pneumatic Tubing to Simplify Automation and Robotics in Food Processing Using Microbe- and Hydrolysis-Resistant Pneumatic Tubing to Simplify Automation and Robotics in Food Processing Datum der Veröffentlichung: 2025-11-20

This article discusses using pneumatic tubing in food processing automation and robotics which have challenges related to hygiene, durability, and maintenance.

Image of Webinar – Driving Miniaturization: Compact SMT Solutions for PCBAs Webinar – Driving Miniaturization: Compact SMT Solutions for PCBAs

Transform your design approach and explore the future of printed circuit board assemblies through the lens of miniaturization and innovation.

Image of Specialty Connectors Offer Automotive-Compatible USB-C Connectivity Specialty Connectors Offer Automotive-Compatible USB-C Connectivity Datum der Veröffentlichung: 2025-11-19

USB-C connectors and matching receptacles are now available for designers of automotive systems, featuring locking, keying, and other ruggedness enhancements.

Image of Unlock Uninterrupted Performance for AI Smartphones: Introducing AZ5D25-01M/AZ5D45-01M TVS Solutions Unlock Uninterrupted Performance for AI Smartphones: Introducing AZ5D25-01M/AZ5D45-01M TVS Solutions

TVS solutions safeguard circuit integrity and signal quality in AI smartphones.

Image of Favorite Things 2025: Top Electronics Tools & Boards for Makers Favorite Things 2025: Top Electronics Tools & Boards for Makers

A curated list of my favorite electronics tools, parts and maker boards for 2025—perfect gifts or upgrades for your workbench.

Image of Cutting-Edge Photon Detection with Broadcom Sensors Modernste Photonendetektion mit Broadcom-Sensoren

Die AFBR-S4-Familie moderner Silizium-Photovervielfacher-Sensoren von Broadcom verbessert die Präzision und Zuverlässigkeit für Hochleistungs-Photonen-Detektionsanwendungen.

Image of Apply Advances in Sensing, Connectivity, and Motion Control Devices for Smarter Fixed-in-Place Robots Apply Advances in Sensing, Connectivity, and Motion Control Devices for Smarter Fixed-in-Place Robots Datum der Veröffentlichung: 2025-11-18

Design precise yet flexible fixed-in-place robotics using advanced control, imaging, sensing, and communications technologies.

Image of Choosing the Right Capacitors for AI Servers: Technical Guidelines for High-Performance Computing Auswahl der richtigen Kondensatoren für KI-Server: Technische Richtlinien für High-Performance-Computing

Kondensatoren spielen in KI-Server-Ökosystemen eine grundlegende Rolle.

Image of TE Connectivity BUCHANAN and ENTRELEC Terminal Block Brands Reihenklemmen der Marken BUCHANAN und ENTRELEC von TE Connectivity

Von der kleinsten Platine bis hin zu industriellen Steuerungen kann die Art und Weise, wie Komponenten miteinander verbunden sind, über Performance, Zuverlässigkeit, Herstellbarkeit und Kosten entscheiden.

Image of Matching Inductors to Critical RF Circuit Applications Matching Inductors to Critical RF Circuit Applications Datum der Veröffentlichung: 2025-11-14

Designers can use high-Q low-loss ceramic inductors from Knowles to meet the critical requirements for RF and microwave applications.

Image of Simplify Global Deployments Using a Universal-Input Rack PDU Vereinfachen Sie globale Bereitstellungen mit einer Rack-PDU mit Universaleingang

Verwenden Sie UPDU-G4-Rack-PDUs, um die globale Bereitstellung von Rechenzentren mit universeller Eingangskompatibilität, flexiblen C39-Steckdosen und sicherer Fernverwaltung zu vereinfachen.

Image of Current Security Challenges in Semiconductor Manufacturing and Effective Countermeasures Aktuelle Sicherheitsherausforderungen in der Halbleiterfertigung und wirksame Gegenmaßnahmen Datum der Veröffentlichung: 2025-11-13

Viele Halbleiterproduktionsumgebungen verlassen sich auf eigenständige Softwaresicherheitssysteme, was zu einem Malware-Risiko über USB-Sticks oder Wartungs-PCs führt.